Pic
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Specification |
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Series: |
智能卡连接器
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Features: |
Security Identity Module (SIM)
Surface mount attach |
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Series: |
DDR2 - FBDIMM - DDR - SDRAM
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Features: |
For JEDEC standard DDR2 and Fully Buffered SDRAM Dual In-line Memory Modules
1.0mm contact (pin-to-pin) spacing
Product Options: Vertical solder tail, vertical press fit, right-angle, 25° angle
240 positions, custom sizes available |
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Series: |
SIMM/MICROEDGE/SDRAM Sockets
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Features: |
For Single In -line Memory Modules and Dual Read-out SIMM and small outline SIMM
Product Options: Vertical, low profile, right-angle, 22° angle
72, 80, 88 and 100 positions
1.27mm contact spacing |
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Series: |
SO DIMM - SDRAM, DDR, DDR2
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Features: |
For JEDEC standard SDRAM, DDR and DDR2 Small Outline Dual In-line Memory Modules
0.6mm and 0.8mm contact spacing
Product Options: Standard and reverse right-angle in various heights off PCB, 22.5° angle (144 position only)
200 pos. - DDR and DDR2, 144 pos. - SDRAM |
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Series: |
离散插座
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Features: |
Low insertion force interface to mating pin
For interconnecting a variety of pin diameters and configurations
Contacts are helical spring and crimped spring with eyelet
1.78mm contact spacing or larger
Manual to fully-automatic insertion equipment available for PCB installation
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Series: |
HXC 插座
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Features: |
LGA compressive interface to package and PCB
For RISC based CPU and ASIC packages, Intel test sockets, board-to-board and flex-to-board interconnections
Conductive metallized polymer compound contacts
.5mm, .8mm, 1.0mm and 1.27mm contact spacing
Custom arrays available |
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Series: |
LGA 插座
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Features: |
LGA compressive interface to package, surface mount solderball attach to PCB
For Intel and AMD CPU PGA packages
Stamped and formed metal contacts
1.1mm x 1.1mm and 1.17mm x 1.09mm contact spacing
Socket arrays up to 1,200+ positions
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Series: |
矩阵系列球形格栅数组（BGA）插座
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Features: |
Fully arrayed patterns available in 1.27mm, 1.00mm and 0.80mm
Allows socketing of BGA devices during prototyping and development
Array sizes up to 40 x 40 (1.27mm), 50 x 50 (1.00mm) and 60 x 60 (0.80mm)
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Series: |
MC-LGA 插座
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Features: |
LGA compressive interface to package and PCB
For RISC based CPU and ASIC packages
Stamped and formed metal contacts
1.0mm, 1.27mm contact spacing
Socket arrays up to 7,396 positions |
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