Up to 100 Amps per linear pcb inch
3 through 8 position
Three levels of sequencing
Compliant press-fit pcb connections
Designed to sequence with Z-PACK 2mm HM and HM-Zd Backplane Connector Systems
Designed to IEC 61076-4-OX
Up to 50 Amps per linear pcb inch
Offered in 8 and 10 positions - 3 Amps per individual contact
Designed to sequence with Z-PACK Futurebus+ backplane connectors
ELCON Crown Band™ power contacts
Low profile (7.5mm) mezzanine/parallel board configurations of power and signal
PC tail and compliant press-fit terminations
Growing family of layouts
Select from either 3A or high conductivity 5A contacts
6 to 140 position connectors
Right-angle, vertical and straddle mount
With or without latches to retain mating pcb
Standard ISA configuration (32 + 18 pairs)
Meets PICMG 3.0 Standard
Duplex plating: 30 micro-inch gold in mating area / tin in termination area.
16 Amps per power contact, 2 Amps per signal contact
Compliant eye-of-needle pcb terminations
No additional pcb retention hardware required
ELCON Crown Band™ power contacts
Modular design allows easily customized configuration
True Hot-Plug contacts allow current interruption under load
Sequenced mating for power and signal
Unique active guide modules double as alignment guide and ground contact
