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Specification

 
Series: 强电流触点
Features: Coaxial Inserts
High Current Inserts

 
Series: ICCON 单柱电源连接器
Features: ELCON Crown Band™ power contacts
35 Amp current rated single-pole power connectors
Board-to-board/busbar/wire interconnection
PC tail and compliant press-fit terminations
Optional locking feature

 
Series: MicroTCA 电源连接器
Features: Designed to PICMG MicroTCA.0 Standards
Industry proven Universal Power Module (UPM) style power contacts
Rated at 14.5 Amps per contact
3 mating levels

 
Series: MINIPAK HDL Connectors
Features: High density 0.8mm contact spacing
Developed to meet next generation 1U application by reducing airflow impedance
Low profile, blind-mate connector

 
Series: MULTI-BEAM XL™ - 配电连接器系统
Features: Blind mateable power distribution system
Up to 150 Amps per linear inch
PCB or cable mounting
PCB solder tail or compliant press-fit connections
Meets Server Systems Infrastructure (SSI) Standard

 
Series: MULTI-BEAM XLE - Power Distribution Connector System
Features: Blind mateable power distribution system
Up to 170 Amps per linear inch

 
Series: Z-PACK TinMan 高密度底板连接器
Features: 100 ohm impedance for differential pair configuration
1.9mm x 1.4mm
Product Options: Right-angle, co-planar, mezzanine
Meets Industry reliability requirements of Bellcore/Telcordia

 
Series: Z-PACK TinMan High Density Orthogonal Connector
Features: 25 Gb/s performance (6 X 6) module
Up to 20 Gb/s performance (6 X 12) module
100 ohm differential impedance
Vertical header 6 X 12 and 6 X 6 modules
Right angle receptacle 6 X 12 and 6 X 6 modules

 
Series: Z-PACK TinMan 85 Ohm Connectors
Features: 85 ohm characteristic impedance for differential pair configuration
 

Orient Silver Mansion, No.5-304, Chang Jiang Road, New District, Wuxi, Jiang Su, China
TEL:86-0510-8522-1066 , 8521-1335 , 8522-2108 　FAX:86-0510-8521-1669