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Specification |
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Series: |
Micro-Strip 连接器
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Features: |
Controlled impedance
0.050” x 0.100” (2-row connector)
Product Options: Right-angle, mezzanine
Available in 40 through 240 positions
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Series: |
高密度 (2mm 及 <2mm 间距)
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Features: |
< .100 Centerline Box Connectors
DensiPac Connectors
High Density Backplane Connectors (Impact™)
MULTIGIG RT
Z-PACK 2mm FB (Futurebus+)
Z-PACK 2mm HM (Hard Metric) PCB Connectors
Z-PACK Slim UHD Connectors
Z-PACK TinMan High Density Backplane Connectors
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Series: |
.100英吋 及 >.100英吋 间距
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Features: |
AMPMODU .031 x .062 (.156) Interconnection System (Mod I)
AMPMODU .031 X .062 (.200) Interconnection System (Mod I)
AMPMODU Headers
AMPMODU Receptacles
AMPMODU Two-Piece Headers & Receptacles
Box Connectors
Eurocard
HDI (Four Beam) & TBC (Twin Beam)
Z-PACK HM-Zd PCB Mount Connectors
Z-PACK SL 100 - Stripline Connectors |
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Series: |
<.100 间距 连接器
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Features: |
2,3 & 4 row product offering with up to 300-pin options
Product offered in board mount, solder eyelet, wire wrap, press-fit, cable and hybrid offerings
External and internal keying available
Four-beam type receptacle contact provides four points of contact
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Series: |
DensiPac 连接器
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Features: |
Open pin field
1.25mm x 2.5mm with double-sided card application
Product Options: Right-angle
Available in 2 row, 2+2row, 4 row, 4 +2 row and 4 + 4 row offering
Surface mount and press-fit attach options |
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Series: |
AMPMODU .031 x .062 (.156) 互联系统 (Mod I)
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Features: |
Rugged wire-to-board, board-to-board discrete wire system featuring 0.031 x 0.062 posts
Housing sizes 2-20 positions for single row board mount receptacles and 2-25 positions for single row headers/crimp housings
Posts available on strip for machine application directly to OPCB or in housings for board mounting
Terminates 26-18 AWG [0.12 - 0.9mm²] discrete wire
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Series: |
AMPMODU .031 X .062 (.200) 互联系统 (Mod I)
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Features: |
Rugged wire-to-board, board-to-board discrete wire system featuring 0.031 x 0.062 posts
Housing size 1-20 positions
Posts available on strip for machine application directly to OPCB or in housings for board mounting
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Series: |
AMPMODU 针座
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Features: |
Open pin field
Single row, 1-40 positions and double row, 2-80 positions
Product Options: Breakaway, B/A surface mount, reeled and stacking in both vertical and right-angle configurations
Stacking heights achieved with combinations of headers and receptacles
Stacking headers have total versatility |
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Series: |
AMPMODU 插座
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Features: |
Open pin field
Single and double row, 2-80 positions, end stackable
Product Options: Horizontal and vertical styles with through-hole and surface mount options
Vertical Mod II Housing Height: .340 with top entry only
Vertical Mod IV Housing Height: .265 with top and bottom entry, dual entry with outrigger and straight tine configuration
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